International SubFAB Research Labs USA (ISRL USA) and AI Infrastructure Partners (AIIP) have agreed to develop what they ...

In2tec has opened what it says is a first‑of‑its‑kind recovery and remanufacturing facility for electronic waste.

Central to the expanded partnership is Google’s Arm‑based Axion processor, which is now positioned as the primary CPU platform within the company’s rack‑scale AI systems. Google Cloud’s move places it ...

Quinas Technology has announced a development milestone in the research and fabrication of its ULTRARAM non‑volatile memory ...

GigaDevice has launched its GD32F5HC series of 32‑bit general‑purpose microcontrollers, expanding its GD32 portfolio.

Siemens has announced an extension of its long‑running collaboration with Taiwan Semiconductor Manufacturing Company (TSMC), ...

Electronics provider Electrica has completed a £1.2 million investment programme to boost its ability to deliver premium ...

ByteSnap Design has launched a new fast-track service aimed at helping device manufacturers migrate legacy products to modern cellular networks ahead of widening 2G and 3G shutdowns.

ROHM has announced the development of its fifth-generation silicon carbide (SiC) MOSFETs, reporting a significant reduction ...

Distributor TTI Europe has announced that it has added TE Connectivity's MULTIGIG RT backplane connectors to stock.

Phoenix Contact has launched a new hybrid connector designed for use in electrical energy storage systems, combining power, ...

Semiconductor start-up Syenta has raised $26 million in Series A funding to accelerate the commercialisation of its advanced ...