A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

The race for faster, more efficient chips has reached a new milestone. Scientists at Shanghai’s Fudan University have unveiled the world’s first full-featured 2D flash chip, an engineering feat that ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

An international team of researchers has demonstrated a novel solvent process for pure and highly crystalline 2D perovskites, which they demonstrated in 2D/3D perovskite solar cells. A n-i-p champion ...