What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Stacking dies will dramatically improve performance, but it’s still a work in progress.
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
Nanoelectronics deal with extremely small electronic components — transistors, sensors and circuits that can fit on the tip of a needle. This technology powers our everyday lives through devices such ...
Interesting Engineering on MSN
World’s first 2D-silicon hybrid flash chip achieves record speed and 94% memory yield
The race for faster, more efficient chips has reached a new milestone. Scientists at Shanghai’s Fudan University have unveiled the world’s first full-featured 2D flash chip, an engineering feat that ...
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